HPE ProLiant DL360 Gen11 5416S 2.0GHz 16-core 1P 32GB-R NC 8SFF 800W PS Server

MPN: P51931-421
Quick Code: B47476849
(HPE DL360 GEN11 5416S 1P 32G NC 8SFF)
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HPE ProLiant DL360 Gen11 5416S 2.0GHz 16-core 1P 32GB-R NC 8SFF 800W PS Server
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£8831.62
£10597.94 inc. VAT
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Quick Code: B47476849
MPN: P51931-421
Manufacturer: HPE
EAN Code:
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HPE ProLiant DL360 Gen11 5416S 2.0GHz 16-core 1P 32GB-R NC 8SFF 800W PS ServerProLiant DL360 Gen11 5416S 2.0GHz 16-core 1P 32GB-R NC 8SFF 800W PS Server

Are you looking for a scalable, compute-dense solution for hybrid cloud or other data workloads in a virtualized and containerized environment? The HPE ProLiant DL360 Gen11 server is a rack-optimized, 1U 2P solution that delivers exceptional compute performance, upgraded high-speed data transfer rate, and memory depth at 2P compute capability. Powered by 4th and 5th Gen Intel Xeon Scalable Processors with up to 64 cores, 8 TB of memory, and 20 EDSFF drives as well as increased memory bandwidth and high-speed PCIe Gen5 I/O, the HPE ProLiant DL360 Gen11 server is a perfect solution for Electronic Design Automation (EDA), CAD, and VDI. The HPE ProLiant 360 Gen11 server is engineered to optimize IT with a cloud operating experience, built-in security, and optimized performance for workloads to drive your business forward.

What is new supporting point:
Powered by 5th Gen Intel Xeon Scalable Processors that supports up to 64 cores & 385W, and 16 DIMMs for up to 8 TB of high bandwidth DDR5 memory up to 5600 MHz.
16 DIMMs per processor for up to 8 TB total DDR5 memory per server with increased performance, High Bandwidth Memory (HBM) support, and lower power requirements.
Advanced data transfer rates and higher network speeds from the PCIe Gen5 serial expansion bus, with up to 2 x16 PCIe Gen5 and 2 OCP slots.
Includes the new HPE Integrated Lights-Out 6 (iLO 6) server management software that enables you to securely configure, monitor, and update your HPE ProLiant Gen11 servers seamlessly, from anywhere.
Supports up to three single-wide (SW) GPUs[1] to accelerate graphic intense workloads.
Supports Liquid Cooling Modules for highest thermal design points (TDPs).